Device reports the following for FPC 3, indicating a thermal event followed by a BT power optimization notice:

>show chassis environment fpc 3 no-forwarding

FPC 3 BT-1 Temp Sensor 0       OK         97 degrees C / 206 degrees F
FPC 3 BT-1 Temp Sensor 1       OK         100 degrees C / 212 degrees F   ==== >>>> hits threshold / may go higher 
FPC 3 BT-2 Temp Sensor 0       OK         61 degrees C / 141 degrees F
FPC 3 BT-2 Temp Sensor 1       OK         61 degrees C / 141 degrees F

Device reports the following for FPC 3, indicating a thermal event followed by a BT power optimization notice:

1. Elevated Temperature on BT Chip 1

BT-1 sensors on FPC 3 recorded temperatures that hit threshold or may go higher, likely triggering thermal mitigation.

>show chassis environment fpc 3 no-forwarding

FPC 3 BT-1 Temp Sensor 0       OK         97 degrees C / 206 degrees F

FPC 3 BT-1 Temp Sensor 1       OK         100 degrees C / 212 degrees F   ==== >>>> hits threshold / may go higher

FPC 3 BT-2 Temp Sensor 0       OK         61 degrees C / 141 degrees F

FPC 3 BT-2 Temp Sensor 1       OK         61 degrees C / 141 degrees F

2. Power Optimization Triggered

A thermal mitigation response was initiated for BT Chip 1 on FPC 3.

Relevant log:

re0-hwdre: HWD_FPC_VOLT_POWER_OPTIMIZED_NOTICE: BT power optimized for Chip 1 Fru /Chassis[0]/Fpc[3]

Note: This log message is purely informational. It is not a consequence of any CMError and does not indicate a failure. Sometimes it may appear alongside other events, but there is no direct correlation.

Recommendations:

1. Monitoring & Alerting
   Continuously monitor temperature readings and BT power optimization notices for FPC 3.

Recommended Commands:

• Run below command to verify FPC temperature readings

              >  show chassis environment fpc 3

• Collect system log messages and chassisd logs, and review them for any power-related entries, as they may provide additional insight

2. Cooling & Environmental Check
   Inspect the physical and environmental conditions surrounding FPC 3 to ensure optimal cooling.

Checklist:

• Verify fan operation and airflow direction.
• Inspect for dust accumulation or airflow obstructions.
• Confirm ambient temperature and rack cooling performance.

3. Escalation / Hardware Replacement (Conditional) – RMA

• If elevated temperatures persist despite environmental mitigation, contact TAC for further guidance.
• Hardware replacement (RMA) may be considered based on TAC recommendations.